The method of reducing the thermal resistance of immersion cooling system of supercomputer
Abstract
The method of reducing the thermal resistance of immersion cooling system of supercomputer
Incoming article date: 29.11.2015Low heat transfer coefficient per unit area is main disadvantage of immersion cooling system. In the theoretical part of the study the main issue was to evaluate the influence of various factors on the convective heat transfer between the solid-liquid interface. The result of this part of study was conclusion that the type of fluid flow in the area of heat transfer is key factor of increase heat convective heat transfer of thermal contact. The Reynolds number is main characteristic of turbulence of fluid flow. Therefore in the experimental part describes study of the effect of the degree of turbulence of the fluid flow at the place of the thermal contact on thermal resistance of immersion cooling system. The design of experimental setup and its main parts is describe further. The result of the experiment is graphic of experimental curve of the thermal resistance of immersion cooling system from the Reynolds number of fluid flow of thermal contact between the solid-liquid interface. The study showed the possibility of local reduction of the thermal resistance of immersion cooling systems to maintain the quality of the thermal management of computing elements that emit significant heat. The results of the study is define the ranges of values of the Reynolds number of cooling system that allows the technical realization at the current dimensions of packages and sizes of microchips sockets.
Keywords: microchip, heat flow, cooling system, Laplace's equation, turbulent flow, Reynolds number, heat transfer, thermal resistance, electrothermal analogy, thermal protection